FCU Dean Wang Chi-Chang’s Team Wins Inaugural TSIA Semiconductor Equipment Innovation Award

The Taiwan Semiconductor Industry Association (TSIA) presented its inaugural TSIA Semiconductor Equipment Innovation Award in 2026, with only three universities nationwide receiving the honor. Chi-Chang Wang, Distinguished Professor and Dean of the College of Engineering and Science at Feng Chia University, led students Po-Yao Chen, Yu-Chia Liang, and Ju-En Ku from the Green Power Laboratory to win the award with their project, “Improving Advanced Packaging Furnace Systems and Solving Energy-Saving Challenges Through Thermal and Structural Simulation Analysis Integrated with AI Technologies.”

This recognition highlights Feng Chia University’s long-term commitment to semiconductor equipment research and development while further strengthening the industry-academia foundation for the planned establishment of the College of Semiconductor Technology in Academic Year 2027–2028.

Chi-Chang Wang, Dean of the College of Engineering and Science at Feng Chia University, received the inaugural TSIA Semiconductor Equipment Innovation Award.

One major challenge facing the semiconductor industry is the shortage of advanced mechanical simulation specialists and the difficulty of translating academic research into practical industrial applications. Drawing on more than 30 years of experience in mechanics and simulation analysis, Dean Wang’s team directly addressed real-world equipment manufacturers’ needs.

The team not only optimized temperature uniformity and energy efficiency in various industrial furnace systems but also transformed complex mechanical models into a suite of customized applications. These tools allow application engineers without advanced theoretical backgrounds to quickly obtain visualized simulation results simply by entering equipment geometry, material properties, and process parameters.

The team also integrated C# programming and AI models to develop a cyber-physical integration platform, enabling equipment to predict performance conditions and automatically adjust operating parameters. Additionally, they developed temperature and thermal displacement measurement systems together with AI-powered thermal compensation technology, significantly reducing positioning errors and improving temperature uniformity. These innovations address critical challenges in advanced semiconductor packaging processes.

Recognizing the importance of industry-academia collaboration, Dean Wang has actively promoted laboratory transformation since 2013. With the rapid growth of the semiconductor industry, his team has worked closely with leading companies such as C Sun Manufacturing and Victor Taichung Machinery Works on semiconductor equipment development projects.

Over the past five years, the laboratory has completed 21 industry-academia collaboration projects with total funding exceeding NT$36 million, more than half of which focused on semiconductor equipment technologies. The team has also completed five technology transfer projects, including key technologies related to hot-plate temperature uniformity enhancement and intelligent burn-in thermal simulation systems, successfully transforming academic research into industrial competitiveness.

In talent development, Dean Wang collaborated with the College of Information and Electrical Engineering to establish the TSMC Semiconductor Program, attracting more than 1,000 FCU students—reportedly the highest participation among Taiwan’s universities. The University has also organized 21 cohorts of students to receive hands-on training at TSMC’s training center.

Meanwhile, the College has partnered with Macronix International on an integrated five-year talent cultivation program and launched industry-sponsored courses in collaboration with major companies including C Sun, Micron, UMC, SPIL, and Ardentec, incorporating real industrial projects and equipment practices into classroom learning.

Feng Chia University and C Sun Manufacturing have collaborated in industry-academia partnerships since 2006, achieving significant成果 over nearly two decades.

Dean Wang emphasized that bringing real industrial challenges back into the laboratory is the foundation of both technology innovation and talent cultivation.

“This award recognizes our team’s long-term dedication to industry-academia collaboration and reaffirms the importance of integrating academic research with industrial practice.”

He also expressed hope that more young researchers will enter the semiconductor equipment field and contribute to Taiwan’s development of indigenous semiconductor equipment technologies.

Building on these achievements, Feng Chia University is preparing to establish its College of Semiconductor Technology in Academic Year 2027–2028. From supporting advanced equipment development and cultivating future semiconductor engineers to winning the inaugural TSIA Innovation Award, FCU continues to build a comprehensive semiconductor talent ecosystem designed to equip graduates with practical skills, industry experience, and global perspectives from day one.

Dean Chi-Chang Wang discusses research progress with students in the laboratory.

Dean Chi-Chang Wang attends the FCU × Macronix “3+2 Bachelor’s-Master’s Dual Degree Program” information session, encouraging students to take advantage of industry-academia collaboration opportunities and plan their future careers early.