FIP-SPE@FCU Approved by the Ministry of Economic Affairs International R&D Program: Taiwan-Germany Joint Development of Smart Coating Technology

FengChia Featured 2025.10.30

Last October, Feng Chia University partnered with the Fraunhofer Society—the world’s largest applied research organization in Germany—to establish Taiwan’s first FIP-SPE@FCU International Innovation Platform. This platform serves as a vital bridge for Taiwan-Germany technology exchange, industry collaboration, and talent cultivation. This year, the platform was approved for the Taiwan-Germany Innovation R&D Collaboration Project under the Ministry of Economic Affairs’ “A+ Enterprise Innovation R&D Program,” officially launching the initiative.

Feng Chia University Signs Three MOUs with Farglory Group Enterprises in One Go, Upgrading Industry-Academia Collaboration and Highlighting Home Purchase Benefits

FengChia Featured 2025.09.23

Feng Chia University continues to promote deep industry-academia connections. On September 23, the university signed industry-academia cooperation memoranda of understanding with Farglory Construction, Farglory Engineering, and Farglory Real Estate at Virtuosi Hall. This is the first time that Feng Chia University has adopted a “three-in-one signing” approach, simultaneously collaborating with the three major sectors of construction, engineering, and real estate, establishing a brand-new model for talent cultivation and industry development. In the future, the focus of cooperation will include student internships, industry experts teaching courses, corporate employee training, faculty support for project research, as well as jointly organizing professional activities and project collaborations. Through a multi-level cooperation framework, students will not only be able to accumulate project experience in advance, but also closely align their learning process with industry development trends.

Model of Industry-Academia Collaboration: Feng Chia University and Gallant Precision Machining Co., Ltd. Sign Industry-Academia Alliance to Establish Advanced Energy and Thermal Management Laboratory

Research and Development 2025.05.09

The semiconductor industry has been one of the most prominent industries in Taiwan in recent years. With the issue of net-zero carbon emissions, the high-energy consumption semiconductor manufacturing process is a challenge that the industry urgently needs to address. To continuously cultivate engineering and research talents with practical experience and capabilities, and to develop energy-saving equipment for high-energy consumption, Feng Chia University and Gallant Precision Machining Co., Ltd. signed an industry-academia alliance memorandum of cooperation on May 8 at Feng Chia University, represented by President Wei Wang and General Manager You-Wen Liang. Through the donation of instruments and equipment, they demonstrated their long-term cooperation idea of jointly establishing the "Advanced Energy and Thermal Management Laboratory."

The First Feng Chia University Technology Innovation Competition: From CDIO to Practical Stage, Inspiring Students' Interdisciplinary Creativity

FengChia Featured 2025.05.06

Jointly organized by Feng Chia University's Office of Technology Development, Office of Sustainability and Social Responsibility, and Office of Industry-Academia Operations and Promotion, the "2025 Feng Chia University Technology Innovation Application Competition" underwent nearly six months of submissions and preliminary reviews. On May 2, the grand final and exhibition were held on the 8th floor of the Science and Aeronautics Building. The competition encouraged students to use innovative technology to solve practical problems, cultivating interdisciplinary integration capabilities. It attracted 70 student teams and over 300 faculty and students from across the university. Ultimately, 41 teams stood out and advanced to the finals, competing in the two main themes of "Digital Applications" and "Sustainable Development," showcasing their achievements.

From Ruins to Hopeful Library! Feng Chia University Collaborates with Yunlin County to Create "Dou-Nan Railway Mini Library" Using Architectural Expertise to Give Back to Society

FengChia Featured 2025.04.15

Once overgrown with weeds and sealed away for years, the Dou-Nan Railway Warehouse is about to transform into a community learning hub filled with hope and knowledge! Feng Chia University's College of Architecture has long been dedicated to rural education and the regeneration of public spaces. On April 14, the university officially launched the "Dou-Nan Railway Mini Library and Community Integration Space" project, partnering with the Yunlin County Government, architectural faculty and students, and local organizations to revitalize unused spaces and create a new hub for reading, integration, and innovation.

Feng Chia University Partners with N&M to Promote Silicon Photonics Sensing Technology and Develop Smart Healthcare Ecosystem

FengChia Featured 2025.03.28

Silicon photonics sensing technology is creating a new wave in global smart health applications. To accelerate the practical implementation of this cutting-edge technology in the smart healthcare field, Feng Chia University's FCU-MIC Smart City 5G Lab and N&M, the world's first company to design silicon photonics sensing chips based on Si-CMOS processes, have partnered to host the "Silicon Photonics Sensing in Smart Health Innovation Applications Forum" on campus yesterday (27th). Experts from industry, government, and academia were invited to discuss how silicon photonics sensing technology can drive the development of the smart health industry and promote a 5G smart healthcare ecosystem covering detection, health management, and long-term care services.

Feng Chia University and Micron Sign Memorandum of Understanding to Deepen Industry-Academia Cooperation and Cultivate Semiconductor Talent

FengChia Featured 2024.12.27

Feng Chia University and the global semiconductor leader Micron Technology recently held a memorandum of understanding (MOU) signing ceremony, represented by Lu Dong-Hui, Chairman of Micron Taiwan, and Vey Wang, President of Feng Chia University. This collaboration aims to deepen cooperation in talent training, technical exchanges, and industry-academia projects, injecting new momentum into the future development of the semiconductor industry.

Taiwan's First! Feng Chia University Partners with Fraunhofer Society to Establish Innovation Platform

FengChia Featured 2024.10.28

Feng Chia University has been tirelessly promoting international cooperation and has collaborated with the Fraunhofer Institute for Surface Engineering and Thin Films (Fraunhofer IST) for nearly a decade. During this period, the collaboration projects included bilateral industry-academia cooperation, joint seminars and forums, the establishment of joint laboratories, personnel exchanges, and the joint proposal of cooperation plans. With fruitful cooperation results, the world's largest applied research organization, the Fraunhofer Society, and Feng Chia University agreed to expand their cooperation and jointly establish an international innovation platform on campus, named the Fraunhofer Innovation Platform for Surface and Production Engineering for Optical and Electrical Systems at Feng Chia University (FIP-SPE@FCU). The platform was officially inaugurated today (28th), marking the first Fraunhofer FIP international innovation applied research organization in Taiwan.

2024 Taiwan Innotech Expo Feng Chia University Wins 2 Gold, 1 Silver, and 2 Bronze Medals

FengChia Featured 2024.10.21

The "2024 Taiwan Innotech Expo" was held from October 17 to 19 at the Taipei World Trade Center Hall 1. Feng Chia University exhibited six patents in the "Invention Competition Area" of the school invention zone, among which five patents won 2 gold, 1 silver, and 2 bronze medals.